| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
Lewis & Clark | http://www.lewis-clark.com/product-tag/solder-paste-inspection/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
Lewis & Clark | https://www.lewis-clark.com/product-tag/solder-paste-inspection/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
Lewis & Clark | http://www.lewis-clark.com/product-category/spi/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
Lewis & Clark | https://www.lewis-clark.com/product-category/spi/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
Lewis & Clark | http://www.lewis-clark.com/product/koh-young-ky-8030-3l-3d-solder-paste-inspection-system/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
| http://etasmt.com/cc?ID=te_news_bulletin,24965&url=comment
Lead-free paste alternatives are available successfully in major production lines. -News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
Lewis & Clark | https://www.lewis-clark.com/product/koh-young-ky-8030-3l-3d-solder-paste-inspection-system/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
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