Industry Directory | Manufacturer / Other
Manufacturer of SMD/BGA Reworking Systems and Stations, a New Products Name Like RE-7500, iSolder-40 & RE-8500
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic optical alignment mobile phone BGA rework station with HD camera Our
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Hottest professional mobile phone repair machine WDS-700 auto bga chipset rework station with free training
Electronics Forum | Mon Sep 27 06:36:34 EDT 2010 | san_1023
At present, Infrared soldering technology became popular due to stream progress in the field of electronics. The stations become more popular among masters, engaged in repairing of composite printed-circuit boards, BGA reballing, soldering in hard-to
Electronics Forum | Fri Nov 20 17:50:51 EST 2009 | bigalnz
Hi All, I do PC/Laptop repair and are finding some jobs I cant do because they need a BGA rework. I dont admit to being a pro with respect to BGA, and thus a purchase decision is hard.I have been looking at : http://zhuomao.en.alibaba.com/product/
Industry News | 2008-08-03 12:48:00.0
New Lead-free compatible, IR-based Unit Reworks all BGA components, including Plastic parts, PTH Sockets, SMD Connectors and Metal Shields
Industry News | 2009-04-02 09:23:02.0
Economic woes � Chinese companies vie for increased sales
Lead-Free Rework Process For Chip Scale Packages News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-Free Rework Process For Chip Scale Packages Universal Instruments
Assembly Process Variables Voiding At A Thermal Interface News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effects of Assembly Process Variables On Voiding At A Thermal
