249 rf and via results

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need

SMT Express, Volume 3, Issue No. 10 - from SMTnet.com

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

SMTnet Express - April 12, 2018

SMTnet Express - May 16, 2019

increases, Via-In-Pad Plated Over (VIPPO) has b

SMT Express, Issue No. 2 - from SMTnet.com

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

SMT Express, Volume 5, Issue No. 12 - from SMTnet.com

3D ICs With TSVs - Design Challenges And Requirements

with through-silicon vias (TSVs). 3D ICs promise "more than