Industry Directory: rf shield clip (14)

Faspro Technologies, Inc.

Faspro Technologies, Inc.

Industry Directory | Manufacturer of Components

Board level EMI/RF shields, wireless antenna, electrical contacts and clips are typical examples of components we manufacture.

P&P Technology Ltd

P&P Technology Ltd

Industry Directory | OEM

Specialist manufacturers of EMI /RF screening and shielding products

New SMT Equipment: rf shield clip (1291)

5G communication board PCB design case

New Equipment | Prototyping

[Single board type] 5G RF communication board (VPX architecture) [Pin number] 10731 [layers] 16 layers [Maximum rate] 10Gb/s [Difficulties]: 1, There are 8 RF channels, the RF line rate is 2.5G, and the requirement of the signal integrity is hig

ShenZhen J-wide Electronics Equipment Co.,Ltd

rf shielding

rf shielding

New Equipment | Materials

Material : Tinplate, Nickel silver ,etc... Shield type :one piece ,two piece (frame and cover),shield clip Dimension: As your drawing Tolerance: +/-0.05mm ,If you have higher require please advise Process: Stamping ,plating if needed Surface tre

Jingyi Precision Technology Co.,ltd

Electronics Forum: rf shield clip (56)

RF shield clips

Electronics Forum | Thu May 01 11:56:04 EDT 2008 | realchunks

It sounds like this part is floating on your solder joint during reflow. You may need to redesign your pad geometry. In general with this type of clip - smaller pads are better. If you cannotcahnge pad size, try changing the openings on your stenc

RF shield clips

Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf

We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons

Used SMT Equipment: rf shield clip (33)

Universal Instruments Conductive Fabric

Universal Instruments Conductive Fabric

Used SMT Equipment | General Purpose Equipment

  Shield efficiency,impedance of clip measurement and flexibility of product of our company are the best ones,it can be used for special shield clothes for high radiation in electronic and electromagnetic industries,special shield cloth of shield r

China EMI Shielding Materials Co.,LTD

Gigatronics conductive fabric over foam

Gigatronics conductive fabric over foam

Used SMT Equipment | General Purpose Equipment

  The EMI Shielding Gaskets are made of spong and conductive fabric which can be used in the gap of the equipments and provide a connection.They have good shield efficiency,impedance of clip measurement,it can be used for the high radiation instrum

China EMI Shielding Materials Co.,LTD

Industry News: rf shield clip (34)

Nordson ASYMTEK Teams with Parker Chomerics for High-volume, Precision Conductive Coating Spray Application

Industry News | 2016-07-10 13:54:05.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.

Nordson ASYMTEK

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Parts & Supplies: rf shield clip (58)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Panasonic 011AC181131 Photo Sensor

Panasonic 011AC181131 Photo Sensor

Parts & Supplies | Sensors

Supply original new spare parts for Panasonic machines 1086620934301 1086620934401 CCD Mirror N3220250-169 COVER1 025-0498-000 CONTROL UNIT1N201 N210XPSC-372 . RELAY UNIT2 XPS-CM1144 S POWER SUPPLY UNIT 1N007 N210P2RF05E SOCKET2 P2RF-05-E N

KingFei SMT Tech

Technical Library: rf shield clip (41)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: rf shield clip (9)

Solder Paste capabilities with the SV-100 Slider Valve

Solder Paste capabilities with the SV-100 Slider Valve

Videos

Dispensing dots, lines and into recessed cavities. Video was shot with a lipstick camera mounted to the dispense head. http://www.nordsonasymtek.com

Nordson ASYMTEK

SMT rf shielding cover

SMT rf shielding cover

Videos

Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing

Ningbo Hexin Electronics Co.,Ltd.

Events Calendar: rf shield clip (1)

2017 RaMP Workshop and Tabletop Exhibition

Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France

2017 RaMP Workshop and Tabletop Exhibition

International Microelectronics Assembly and Packaging Society (IMAPS)

Career Center - Resumes: rf shield clip (2)

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0

Engineering

Engineer

Career Center | Kathmandu, Nepal | Engineering

I have been working from last 4 years in different field and  post. Where i can gather different experiences and enhanced my knowledge of real field. I am really storng canididates for the technical post. Hon of bachelor in electronics and communicat

Express Newsletter: rf shield clip (146)

Partner Websites: rf shield clip (86)

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

| http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

resolution, 16-bit 1 available USB port for data download 1 available USB port for software key     Included KIC 'X 5 ' Kit Contents Slim-design thermal profile Thermal shield Software CD with Navigator Power and SPC software Software protection dongle USB cable (A male/mini-B) RF transmitter (on RF models) AAA batteries (6


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