New SMT Equipment: rosin joint (Page 1 of 1)

Kapp Electric Eutectic - Tin Lead Silver Solder for Electronics ( solid or Rosin cored )

Kapp Electric Eutectic - Tin Lead Silver Solder for Electronics ( solid or Rosin cored )

New Equipment | Solder Materials

With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app

Kapp Alloy & Wire, Inc

KappZapp7R Rosin-cored Solder

KappZapp7R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c

Solder Direct

ALPHA® Cored Wire

ALPHA® Cored Wire

New Equipment | Solder Materials

Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies.  The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys.  A

MacDermid Alpha Electronics Solutions

CYBERSOLV® 141-R - Precision Aerosol Cleaner

CYBERSOLV® 141-R - Precision Aerosol Cleaner

New Equipment | Cleaning Agents

CYBERSOLV® 141-R is a precision cleaner blend of organic solvents that is safe and ready to use for bench-top electronics cleaning. CYBERSOLV® 141-R is effective on a wide variety of soils typically found in electronic assembly and maintenanc

KYZEN Corporation

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

New Equipment | Cleaning Agents

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the late

KYZEN Corporation

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