Technical Library: s & 0 (Page 1 of 4)

Are You Ready for Lead Free

Technical Library | 2023-01-17 17:37:45.0

Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.

Heller Industries Inc.

Efficient SMT & DIP PCB Handling Solutions for Your Production Line

Technical Library | 2023-09-16 06:23:58.0

Explore our SMT & DIP PCB handling machine to optimize your manufacturing process. Enhance efficiency and precision in handling printed circuit boards.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

On Oreology, the fracture and flow of "milk's favorite cookie® "

Technical Library | 2024-08-29 18:30:46.0

The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study

1st Place Machinery Inc.

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2021-06-15 15:17:33.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Specifying Current for the Real World

Technical Library | 1999-05-06 15:14:48.0

To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating.

TE Connectivity

Nanocoatings Webinar & NanoClear® Stencil Treatment

Technical Library | 2023-05-22 17:13:17.0

Agenda Overview Independent Testing & Studies-Print studies -Understencil Wipe studies-Durability Testing-Ongoing Studies NanoClear Product Information NanocoatingsComparison Summary Questions

Aculon

How to Control Speed of Servo Motor & Anti-Interference Measures

Technical Library | 2021-12-31 01:27:08.0

A servomotor refers to the actuator to control the operation of mechanical components in the servo system and is a subsidy motor indirect transmission device. The servo motor can control speed, whose position accuracy is high, and convert voltage signal into torque and speed to drive the controlled object. A servomotor speed is controlled by the input signal, responding quickly.

OKmarts Industrial Parts Mall

Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test

Technical Library | 2016-02-04 19:11:47.0

In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.

Keysight Technologies

CORRELATION BETWEEN CALCULATION AND PRACTICE FOR SIMPLE TOP-TO-BOTTOM PCB HEAT DISSIPATION USING TIM & VIAS

Technical Library | 2024-07-24 01:27:58.0

A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have  The thickness of a TIM is often more critical than the thermal conductivity of the material  The thermal resistance of the surface between the materials are most critical  Better use many small vias than a few big vias!  Plated or filled vias are very expensive to get, better try to stay with standard!

Würth Elektronik GmbH & Co. KG

Silver in Printed & Flexible Electronics

Technical Library | 2021-07-13 19:54:59.0

This Market Trend Report for the Silver Institute examines silver's growing role in printed and flexible electronics. According to our research, 33.9% of the annual silver global supply in 2020 ended up in electronics. This is a total of 327 million troy ounces (Moz) that finds its way into various electronics markets every year. Given the projected growth of electrification, we are confident that this will continue to grow over time since silver is the world's most conductive material.

Silver Institute

  1 2 3 4 Next

s & 0 searches for Companies, Equipment, Machines, Suppliers & Information

HongCheng import & Export co.,Ltd
HongCheng import & Export co.,Ltd

Buy and selling used smt,semi, Robot ,CNC and all used machines

Equipment Dealer / Broker / Auctions

DONGGUAN HUMEN
Dongguan, 30 China

Phone: 13560819457