New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
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New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s - Drives (
Electronics Forum | Fri Mar 03 13:44:36 EST 2006 | Jon Provost
We switched to Sn100C on 2 waves and kept one with SAC305. The SAC305 will be converted to SN100C as soon as the Aim rep. delivers it next week.
Electronics Forum | Fri Jan 20 08:27:28 EST 2006 | Loco
Just wondering what the companies that are use SN100C are using for reflow (I guess SAC), and especially for handsoldering. Do SAC and SN100C mix? are there any studies proving this?
Industry News | 2014-11-22 07:42:40.0
FCT Assembly today announced plans to exhibit at the Space Coast and Tampa Bay Expo & Tech Forum, scheduled to take place Thursday, December 4, 2014 at the Park Inn by Radisson in Kissimmee, FL. Solder expert Rodney Wade will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution-driven solder pastes.
Industry News | 2010-03-22 13:14:36.0
GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.
Parts & Supplies | Other Equipment
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
be an optimal alloying addition in lead-free SAC (
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-lead.php
: The SnPb sphere in Box A accounts for 87% of total box weight. An equivalent-sized sphere of the less dense SAC 305 formulation (Box B) accounts for a lesser percentage of the total weight, 13
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
^ Best Student Paper The following paper was selected as the 2019 Best Student Paper. 2019: Faramarz Hadian, Binghamton University " Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy " View past award winners 2018: Vishnu Reddy, Georgia Tech
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