New Equipment | Solder Materials
KappAloy9™ 91% Tin / 9% Zinc solder is the eutectic standard solder for Aluminum to Aluminum and/or Copper. It is used extensively in oven soldering and other automated soldering systems. Learn more and order: http://www.solderdirect.com/all-produc
Electronics Forum | Thu Jan 29 17:04:43 EST 2009 | jeffjarmato
I run two different waves here one with SAC305 with aqueous flux the other with SN100C and No clean flux. Does anyone see any issues with running product through either machine of course after changing the Flux type? I also only use SAC305 alloy for
Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
Industry News | 2009-06-16 12:26:28.0
New Five-Day Class Teaches Practical as well as Lecture
Industry News | 2013-09-16 13:58:19.0
Baja Bid has wrapped up another series of auctions, selling used SMT equipment in August to various bidders around the world.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
ALPHA® Preforms with solder paste adds solder volume.
SMTnet Express, September 9, 2021, Subscribers: 26,718, Companies: 11,435, Users: 26,839 Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates Manganese can
SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick
| https://pcbasupplies.com/lead-free-solder-paste/
» Lead-Free Solder Paste -SAC305 Jet Dispensable Solder Paste Lead-Free Solder Paste -SAC305 Jet Dispensable Solder Paste $ 43.08 Purchase this product now and earn 4 Points
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste
: Consider Halogen-Free Flux and Solder Paste Back to all posts Part 2 of 2 – The Need for Halogen-Free Materials and the Impact on Your Electronics Manufacturing Process By John Vivari What will happen if halogen-containing substances are banned from use in electronics manufacturing