New SMT Equipment: sac305 and to and other and solder (1)

KappAloy9™ - Solder for Aluminum to Aluminum, Copper and Brass

KappAloy9™ - Solder for Aluminum to Aluminum, Copper and Brass

New Equipment | Solder Materials

KappAloy9™ 91% Tin / 9% Zinc solder is the eutectic standard solder for Aluminum to Aluminum and/or Copper. It is used extensively in oven soldering and other automated soldering systems. Learn more and order: http://www.solderdirect.com/all-produc

Solder Direct

Electronics Forum: sac305 and to and other and solder (4)

SAC305 and Sn100c alloys

Electronics Forum | Thu Jan 29 17:04:43 EST 2009 | jeffjarmato

I run two different waves here one with SAC305 with aqueous flux the other with SN100C and No clean flux. Does anyone see any issues with running product through either machine of course after changing the Flux type? I also only use SAC305 alloy for

solder paste ingredients and their effects

Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris

What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(

Industry News: sac305 and to and other and solder (209)

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

MIRTEC to Demonstrate the Latest in Their Award-Winning 3D AOI and SPI Systems at SMTAI

Industry News | 2019-08-21 16:55:59.0

MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.

MIRTEC Corp

Technical Library: sac305 and to and other and solder (2)

A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste

Technical Library | 2017-04-13 16:14:27.0

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.

AIM Solder

Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs

Technical Library | 2014-10-16 16:39:12.0

Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.

Freescale Semiconductor Inc

Videos: sac305 and to and other and solder (2)

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions

Videos

Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to

BEST Inc.

ALPHA® Preforms with solder paste adds solder volume.

ALPHA® Preforms with solder paste adds solder volume.

Videos

ALPHA® Preforms with solder paste adds solder volume.

MacDermid Alpha Electronics Solutions

Express Newsletter: sac305 and to and other and solder (1081)

SMTnet Express - September 9, 2021

SMTnet Express, September 9, 2021, Subscribers: 26,718, Companies: 11,435, Users: 26,839 Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates Manganese can

SMTnet Express August 29 - 2013, Subscribers: 26233

SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick

Partner Websites: sac305 and to and other and solder (20719)

Lead-Free Solder Paste -SAC305 Jet Dispensable Solder Paste - PCBASupplies

| https://pcbasupplies.com/lead-free-solder-paste/

» Lead-Free Solder Paste -SAC305 Jet Dispensable Solder Paste Lead-Free Solder Paste -SAC305 Jet Dispensable Solder Paste $ 43.08 Purchase this product now and earn 4 Points

Halogens and Halides: Consider Halogen-Free Flux and Solder Paste

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste

: Consider Halogen-Free Flux and Solder Paste Back to all posts Part 2 of 2 – The Need for Halogen-Free Materials and the Impact on Your Electronics Manufacturing Process By John Vivari What will happen if halogen-containing substances are banned from use in electronics manufacturing

ASYMTEK Products | Nordson Electronics Solutions


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