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Engineered Material Systems Introduces 535-18M-57 UV Cure Adhesive for Disk Drive, Camera Module, Optoelectronic and Circuit Assembly Applications

Industry News | 2013-05-22 14:12:24.0

Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.

Engineered Materials Systems, Inc.

Engineered Material Systems Debuts UV Cure Adhesive for Disk Drive, Camera Module, Optoelectronic and Circuit Assembly Applications

Industry News | 2012-06-05 15:47:34.0

Engineered Material Systems introduces 535-10M-1 UV Cured Adhesive formulated for disk drive camera module, optoelectronic and circuit assembly applications.

Engineered Materials Systems, Inc.

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