Industry News: saki error (Page 1 of 1)

Saki Demonstrates 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX Expo Booth 1407

Industry News | 2019-01-22 12:41:53.0

Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.

SAKI America

Saki Demonstrates 3D AOI and 3D AXI Off-line Programming Live at SMTA International in Booth 430

Industry News | 2019-09-10 13:30:52.0

Saki Corporation will present its 3D automated optical inspection (AOI) system and BFX-Editor automated x-ray inspection (AXI) off-line programming and debugging software at SMTA International in booth 430.

SAKI America

Saki to Demonstrate New AOI and SPI Systems at Productronica Stand A2.259

Industry News | 2017-11-10 17:38:29.0

Saki Corporation announces that it will introduce its new 3Di Automated Optical Inspection (AOI) systems at Productronica, stand A2.259. The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3Ơ), height repeatability (below 2µm at 3Ơ), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg.

SAKI America

Saki's 3Di AOI M2M Capabilities Will be on Display as Part of the Fuji America Line at SMTAi Booth 407

Industry News | 2018-10-07 20:05:41.0

Saki Corporation will present its new 3Di Automated Optical Inspection (AOI) system at the Fuji America booth #407, at SMTA International. Saki's AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality. Fuji Corporation is a supplier of surface mount technology pick-and-place solutions and has produced many innovations in the circuit board assembly world.

SAKI America

Saki Corporation Collaborates with Ersa to Demonstrate Benefits of 2D Bottom-side AOI for Inspection after Selective Soldering

Industry News | 2019-08-28 00:00:21.0

Saki Corporation will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa's SMARTFLOW 2020 selective soldering process.

SAKI America

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