New SMT Equipment: saponifiers (Page 1 of 1)

Cyberclean 3000 Stencil Cleaning System

Cyberclean 3000 Stencil Cleaning System

New Equipment |  

The EMC Cyberclean 3000 Stencil Cleaner is designed for use with aqueous chemistries that require a rinse. This cleaner is electric and allows the user to clean with their choice of aqueous chemistry or saponifier. The 3000 series cleans with spray

E M C Global Technologies, Inc.

RMA202-25 Medium Solids, Mildly Activated Flux

RMA202-25 Medium Solids, Mildly Activated Flux

New Equipment | Solder Materials

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based

AIM Solder

RMA202-25 Flux

RMA202-25 Flux

New Equipment | Solder Materials

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based

AIM Solder

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

New Equipment | Cleaning Agents

AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The re

AIM Solder

NC254 Lead-Free & Tin/Lead Dispensing Solder Paste

NC254 Lead-Free & Tin/Lead Dispensing Solder Paste

New Equipment | Solder Materials

NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs.  NC254 has been developed to offer extremely broad process windows for printing, wetting and

AIM Solder

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

HydroJet™ Inline PCB Cleaners

HydroJet™ Inline PCB Cleaners

New Equipment | Cleaning Equipment

Aqueous / Semi-Aqueous Inline PCB Cleaning Systems Durable Construction The HydroJet™ in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding rigid metal chassis, unib

Austin American Technology

ALPHA® Cored Wire

ALPHA® Cored Wire

New Equipment | Solder Materials

Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies.  The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys.  A

MacDermid Alpha Electronics Solutions

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