Industry Directory | Consultant / Service Provider / Manufacturer / Other
Global provider of Legacy PCB Re-Engineering Systems & Process Control Tools since 1990.
Industry Directory | Manufacturer
Vendor of systems for Automated Optical Inspection (AOI), 3D X-Ray Inspection (AXI)and 3D solder paste inspection (SPI). The company's inline and stand-alone AOI systems won several "Best in Test Awards"
New Equipment | SMD Reel Storage
Smart Electronic Shelves Fixed electronic shelf instructions ※ Multi-color LED (set according to the actual needs of customers), support multiple sets of work orders at the same time to prepare materials for delivery ※ double-sided access material ※
Intelligent SMD Component Storage System Feature •Management is simple ▶Reduce manpower and improve efficiency ▶System control FIFO, eliminate human interference ▶Visual management, lights prompt ingredients, reduce staff Operation requirements •Pro
Electronics Forum | Thu Feb 26 09:27:15 EST 2004 | smtprof
How i can adjust sensitivity of scanning unit DP-Axis amplifier ?
Electronics Forum | Fri Feb 27 10:12:36 EST 2004 | stefwitt
The front plate of the S15 head gives you access to the signal amplifier boards. You'll find 4 potentiometers adjusting the voltage and the symmetry of track A and B. A digital scope turned to X+Y provides an image of a circle, which is been adjusted
Used SMT Equipment | Semiconductor & Solar
HITACHI S-3000-N Scanning Electron Microscope (SEM) Not sure of vintage! Full specifications upon request. https://www.karenmadison.com/hitachi-s-3000-n-scanning-electron-microscope-sem/
Used SMT Equipment | In-Circuit Testers
SPEA 4040 Flying Probe with Boundry Scan Model: FP 4040 HI-LINE SERIES 5 Flying Probe Tester Year: 2004 S/N: SWE537FF 4040 Hi Line; high speed high accuracy (1) DRIV-10 V/I Generator; Precision Driver, 4Q, +/-10V, +/- 1A (1) Boost-80 V/I Gene
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
YAMAHA KM5-M4200-010 SYSTEM BOARD W KM5-M4220-002 KM5-M4230-000 KM5-M4200-010 assembly W/YAMAHA ASSY KM5-M4220-002 and KM5-M4230-000 ALSO A FLASHDISK CARD. This CIRCUIT BOARD is used with CSM and SAPPHIRE SYSTEMS. Used: An item that has been used p
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-09-03 17:06:09.0
Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints.
Smart Electronic Shelves Fixed electronic shelf instructions ※ Multi-color LED (set according to the actual needs of customers), support multiple sets of work orders at the same time to prepare materials for delivery ※ double-sided access material ※
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Career Center | Gaithersburg, Maryland USA | Engineering,Production
Test Engineer Design hardware and software solutions required to test data communications products in a low-medium volume, high-mix production test environment. Design and build test fixtures to support these solutions. Support Production Test d
Career Center | Carleton, Michigan USA | Engineering,Sales/Marketing
Proof Of Design, a leading electronics and electromechanical engineering consultancy, needs a very knowledgeable, highly experienced test engineer to join our team for pending contracts. Must have JTAG/Boundary scan experience and the ability to trav
Career Center | GURGAON, India | Engineering,Quality Control,Research and Development
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Career Center | Williamsburg, Kentucky USA | Engineering,Production,Quality Control
SKILLS My computer skills are fluent with experience in Microsoft Word, Internet, WordPerfect and Microsoft Works. I have an extensive electronics background. I can type 40 wpm. I am multi-skilled with a vast knowledge in electronics and over 10 y
SMTnet Express, July 26, 2018, Subscribers:31,208, Companies: 11,001, Users: 24,976 Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly Jun Balangue; Keysight Technologies This paper
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5027
. Cathodic reduction was used to quantitatively determine Ag and Cu corrosion products. Scanning electron microscopy was applied to compare surface morphologies of metal films under various test conditions
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb
