Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Tue Sep 25 15:48:34 EDT 2001 | mparker
Scavenge all the old solder off the board and the chip. Micro screen paste to the chip. As far as thickness, check your aspect ratio to determine the spec. Eliminate just one variable at a time to get to the root cause. Start by not using the tacky
Used SMT Equipment | Repair/Rework
VJ Electronix Benchtop Solder Rework System Vintage: 2013 Model: SRT Micra Micro Assembly & Small Board Rework System High Resolution Vision System Convection Top & Bottom Site Heating Spot Heater 0.3mm Pitch Process Capability 01005
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-04-23 10:57:38.0
MicroCare Asia will use NEPCON Shanghai from 25-27 April as the platform in which to highlight three innovative new cleaning chemistries of the Tergo™ family: the Tergo™ Metal Cleaning Fluid, the Tergo™ Chlorine-Free Cleaning Fluid and the Tergo™ High-Performance Flux Remover.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2013-03-04 16:51:00.0
Chip-scale (or chip-size) packages are rapidly becoming an important element in electronics due to their size, performance, and cost advantages [Hou, 1998]. The Chip Scale Package (CSP) is becoming a key semiconductor package type, particularly for consumer products. Due to their relatively smaller size, new challenges are presented in the rework and repair of CSPs. (...) The specific focus of this paper is the removal process for rework of CSPs and the site scavenging methods required to properly prepare the circuit board for a new component. Process factors such as the heating, fluxing and, atmosphere are discussed.
SCAVENGING Scavenging Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it
