Industry News: screen printing aspect ratio (Page 1 of 9)

MIRTEC Europe and pb tec solutions to Display the Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2014

Industry News | 2014-04-22 14:31:18.0

MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.

MIRTEC Corp

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corp

MIRTEC to Exhibit the All New MV-6 OMNI at Productronica

Industry News | 2015-10-22 16:28:47.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier the technologically advanced MV-6 OMNI 3D Series in Hall A2, Stand 139 at the upcoming Productronica international trade fair, scheduled to take place November 10-13, at the Messe in Munich, Germany.

MIRTEC Corp

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

IPC Honors Best Technical Paper at Annual Meeting

Industry News | 2001-10-18 11:52:16.0

IPC has announced the winner of this year's IPC Annual Meeting Best Technical Paper award. Mike Kittelson and Jess L. Pedigo, from Honeywell Advanced Circuits, received the Best Technical Paper award for A Review of Filling High Density, High Aspect Ratio Vias in A High Volume Printed Circuit Board Industry.

Association Connecting Electronics Industries (IPC)

Count On Tools Releases New ezLOAD Board Support System for MPM SPM Screen Printers

Industry News | 2012-08-10 14:08:21.0

Count On Tools Inc introduces the new ezLOAD PCB Support System for MPM SPM Screen Printers.

Count On Tools, Inc.

Count On Tools’ ezLOAD Board Support System Recognized by NPI Awards

Industry News | 2013-02-20 07:09:59.0

Count On Tools Inc announces that it has been awarded a 2013 NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its ezLOAD Board Support System.

Count On Tools, Inc.

Count On Tools Introduces New EKRA ezLOAD Board Support System

Industry News | 2012-11-23 09:15:12.0

Count On Tools Inc launches the new ezLOAD PCB Support System for EKRA Screen Printers.

Count On Tools, Inc.

Count On Tools Announces Customer Success with ezLOAD Board Support System

Industry News | 2014-01-07 18:55:28.0

Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.

Count On Tools, Inc.

IPC Technology Trends Study Underway, Survey Open Until January 31

Industry News | 2014-01-14 18:37:40.0

IPC – Association Connecting Electronics Industries® released a global survey this month to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC’s 2014 Technology Trends Study.

Association Connecting Electronics Industries (IPC)

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