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., test the actual welding at the solder joint Temperature to set the temperature curve. 2.Control the preheating time, reflow time and cooling time
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copper layer on the PCB, test the actual welding temperature at the solder joint Set the temperature curve. 2. Control the preheating time, reflow time, and cooling time
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: - Image capture system for advanced analysis is quick to set-up and in close proximity to the test head aiding faster testing. - Borescope imaging system provides high magnification imaging ideal for precise tool alignment and perfect for ultra fine pitch devices
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