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Senju Manufacturers solder materials for PCB assembly and we're the leading provider of RoHs complaint Lead-Free Materials world-wide...
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
| https://ipcapexexpo.org/sites/default/files/inline-files/SSSchedule400andabove_0.pdf
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