CAS761 Durostone Material for SMT Fixture and PCB Assembly Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder pa
Premo-Flex™ FFC and etched polyimide jumpers, available in a variety of pitches, cable lengths and thicknesses, plus high-temperature ratings up to +105°C, deliver durable, ultra flexible, competitively priced solutions for PCB connections in virtual
Electronics Forum | Thu Sep 27 09:53:46 EDT 2012 | testbloke
Anyone ?
Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke
Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Tue Feb 14 16:00:00 EST 2017 - Tue Feb 14 16:30:00 EST 2017 | San Diego, California USA
Invited Speaker at APEX 2017 - Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/industries/medical-life-science-and-pharmaceutical?con=t
) Polymer Processing Systems EDI® Layer Multiplication Technology (LMT) developed for film and sheet promises to extend the shelf life of retort, hot fill, and flexible packaging, while increasing the formability in
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
. This type of PCB technology allows for improved functionality in smaller consumer products, denser BGA and QFP packages, and lowered heat transfer induced stress
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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