New Equipment | Solder Materials
The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper
1.Product Introduction The third generation model TM245P is NeoDen Tech’s independent product,with completely independent intellectual property,leading this technology in China. TM245P series is the third generation of Neoden Tech’s desktop pick an
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Wed Apr 13 05:48:52 EDT 2005 | charly
hi' i need advise on immersion silver PCb shelf life. 1) what is the shelf life for Immersion silver PCB? 2) iF PCB expire, can we bake the immersion PCB? what temp & duration? 3) How long can we keep the pCB again after rebaking? (with vacuum seal)
Used SMT Equipment | Pick and Place/Feeders
Hello Friends, We have below original feeders and nozzles to sale, if you have demand, please kindly contact us! Thank you! FUJI CP 6 8*4/8*2 Paper ,CP7 8*4/8*2 Paper NXT 8mm,12mm with tail and without tail. YAMAHA CL 8*4/8*2,12mm,16mm. JUKI FF
Used SMT Equipment | Pick and Place/Feeders
For sales : Siemens HF with MTC2 Siemens HS60 Siemens HS50 Siemens S27 Siemens F5HM Siemens Feeder (HS series) for sales : 3x8 Gold - 55 pcs 3x8 silver - 150 pcs 3x8 HoverDavis New - 50 pcs 2x8 - 200 pcs 12/16 mm- 55 p
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
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Parts & Supplies | Pick and Place/Feeders
30pcs siemens 3*8 silver feeders(00141098-07) 30pcs siemens 3*8 silver feeders(00141098) 15pcs gold feeders(00141099-04) are in stock for sale.Please feel free to contact with your requirements. Thanks Judy judy-zk@hotmail.com
Parts & Supplies | Pick and Place/Feeders
Hello. Following Feeders are on sale now.They are all completed and good working condition. 1.SANYO 3500Z FEEDER CT0851L 8X4 mm CT0852L 8X4 mm CT0860L 8X2 mm CT0861L 8X4 mm CT0862L 8X4 mm CT0880S 8X2 mm CT0881L 8X4 mm CT08
Technical Library | 2023-03-13 19:40:21.0
The present work explores the effects of paper properties on conventional silver-based conducting inks. The effects of smoothness, relative humidity, porosity, permeability and wettability on electrical properties of silver inks on different paper substrates were studied. Another objective of this work was to prepare and study polyaniline synthesized in the presence of different lignosulfonates.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Training Courses | ONLINE | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
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Shelf Bin Archives - PCBASupplies Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
GPD Global | https://www.gpd-global.com/silver-ink-dispensing.php
Silver Ink Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
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