Electronics Forum | Mon Jun 25 11:33:20 EDT 2012 | davef
The immersion silver is an active surface and readily combines with sulfur from the environment. Silver sulfide tarnishes the surface and creates doubt about the integrity of the finish at inspection. [uyemura.com/library-4.htm] Your customer's boar
Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm
Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned
Electronics Forum | Sun Sep 21 10:55:52 EDT 2008 | vladig
As long as the surface is solderable, you should be fine. Silver tarnish a well0-known thing. Make sure, though, there is no sulfur (S) "around". Regards, Vlad
Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine
we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman
Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.
Electronics Forum | Thu Jun 22 07:15:37 EDT 2006 | amol_kane
do you mean microvoids or macrovoids??
Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan
Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.
Electronics Forum | Wed Jun 28 02:29:48 EDT 2006 | Loco
Wow, great article there mike! Thanks for digging it up for us! Kind regards, Loco.
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
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