Flake & Powders for die-Attach adhesives and thick film inks. (Silver, Copper, Silver-Palladium, Platinum)
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Sat Jul 24 01:52:31 EDT 2004 | C.W
thanks Dave!!
Technical Library | 2018-12-05 14:52:23.0
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
today’s lead-free soldering applications. A series of soldering dissolution experiments, modeled on Bader’s, were conducted using SAC305 solder with gold, silver, palladium, platinum, copper and nickel samples
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
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