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Electronics Forum | Thu Oct 05 08:33:27 EDT 2006 | kelleyk2
I suspect the problem has been resolved or in some manner, gone away, but decided to reply anyway. After the demise of Fritsch USA, there was a void in the support chain for Fritsch Germany, the actual manufacturer. I've recently met with the owne
Electronics Forum | Mon Sep 08 11:38:52 EDT 2014 | spoiltforchoice
They key requirement before any fancy tools is careful storage, stock control, labeling and handling. If your parts are incorrect before they even get to production, you're screwed. As gregp suggests, to get consistently correct value and orientation
Used SMT Equipment | Pick and Place/Feeders
hip theoretical speed of 21,000CPH Mounting range 0402mm Chip to 55mm Placement accuracy plus or minus 0.03mm PCB size 460 * 400 * 4.2 ~ 50 * 40 * 0.38 Equipment size L1,650 * D1,680 * H1,530 Power 4.7KVA Equipment weight 1800kg Samsung SMT
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
Parts & Supplies | Pick and Place/Feeders
JUKI Feeder Storage Cart (Can be customized according to customer demand) Specification : Dimension: 800 x 600 x 1100mm, L x W x H Material: Full Stainless Steel Structure: 2 layers, 40pieces per layer With fou
Parts & Supplies | Assembly Accessories
Samsung KSUN CN030 NOZZLES For Pick and Place Machine More SAMSUNG NOZZLES IN STOCK SAMSUNG CP30 M1, M2 , M3 SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 SAMSUNG CP40 N045 / N08 / N14 / N24 / N40 / N75 SAMSUNG CP45 FV TN030 /TN040 / TN065 / T
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
Samsung/ Hanwha SM481 Plus Techwin Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick
Samsung/ Hanwha SM482 Plus SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and
SMTnet Express, July 5, 2018, Subscribers: 31,155, Companies: 10,978, Users: 24,902 Inkjet-Printed and Paper-Based Electrochemical Sensors Ryan P. Tortorich, Hamed Shamkhalichenar, Jin-Woo Choi; Louisiana State University It is becoming
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
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