Electronics Forum | Mon Jul 18 01:47:29 EDT 2005 | Cal
I would suggest 1) Use the profile that is suggested with the BGA types you are using or 2) Have you solder paste rep visit for a half day and help profile your machine. Remember if they want to keep you as a paste customer they will help. Enjoy,
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
Electronics Forum | Mon Jul 18 02:47:27 EDT 2005 | grantp
Hi, It sounds like your a little new at profiling, and can be difficult to do well. We purchased a KIC profiler that has software that will take your profile data and tell you the best oven temperature settings and conveyer speed to use. You need
Electronics Forum | Thu May 07 15:24:57 EDT 2015 | twf
Hello Fellow SMTnet Members, taking a quick survey: Your SMT production line comes to a halt. What's your top 3 planned and unplanned causes for this?
Electronics Forum | Tue Mar 01 08:21:37 EST 2005 | David Bratcher
What thickness is required to process a double sided board with white tin? Is there an IPC standard? If rework is necessary, what is required?
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
Electronics Forum | Thu Apr 12 00:56:20 EDT 2007 | Jani
Our SMT production and storage area is air-conditioned, constant temperature is maintained but the humidity is not controlled , the raw SMT material is stored in a "Drier" cabinet, but since we assemble hybrid SMT and thru-hole PCB assemblies, the SM
Electronics Forum | Thu Apr 12 22:00:58 EDT 2007 | davef
Search the fine SMTnet Archives, for instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=46687
Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas
Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo
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