Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Tue Sep 26 12:04:11 EDT 2006 | sliebl
Is there a difference between SN100, SN100C, and SN100CL?
Used SMT Equipment | Repair/Rework
CONCEPTRONIC, Reworking station, type FREEDOM 3000, s.n. 9410051, equipped with LEICA binocular, with 2 optical magnifier 10x included, analogic readers front, AEG plc, inside control PC with Samsung flat monitor, and 8 nozzles, size approx 1,40x1,00
Used SMT Equipment | Soldering - Wave
Make: Speedline Technologies Model: Vectra Elite Vintage: 2006 Description: Wave Soldering Machine Notes: Lead-Free Includes Approx 1800 LBS SN100C 3 Bottom-Side Heaters 1 Top-Side Heater Condition: Complete & Operational Availability: May
Industry News | 2018-10-18 09:29:21.0
Wave soldering welding interview direct contact with high temperature liquid in the production
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Parts & Supplies | Other Equipment
JUKI FX-3/FX-3R Z motor HC-BH0336LW4-S1 30W PN 40048065 JUKI 2010 Z motor TS4633N2020E600 48V 30W E9629729000 JUKI 2010 T motor TS4632N2020E600 48V 20W JUKI 2010 X motor TS4509N2821E200 400W JUKI 2010 Y motor TS4515N2821E201 950W
Parts & Supplies | SMT Equipment
JUKI FX-1/FX-1R T motor HC-BH0136L-S14 10W 40068459 JUKI FX-1/FX-1R Y motor HC-MFS73(-S33) 750W JUKI FX-3/FX-3R Z motor HC-BH0336LW4-S1 30W PN 40048065 JUKI 2010 Z motor TS4633N2020E600 48V 30W E9629729000 JUKI 2010 T motor TS4632N2020E600 48
Technical Library | 2008-03-31 21:35:36.0
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
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SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
Heller 公司 | https://hellerindustries.com.cn/browse/page/100/
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