| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
: I know for tinning stranded wires you should not use Type H or M flux, so we are ordering a No-clean solder Sn63Pb37 with a flux designator ROL0
| http://etasmt.com/cc?ID=te_news_industry,24162&url=_print
is no qualitative change. the key of lead-free is in the reflow oven. The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5
| https://www.eptac.com/faqs/ask-helena-leo/page/5
: I know for tinning stranded wires you should not use Type H or M flux, so we are ordering a No-clean solder Sn63Pb37 with a flux designator ROL0
| http://etasmt.com/te_news_industry/2021-09-01/24162.chtml
is no qualitative change. the key of lead-free is in the reflow oven. The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5
| http://etasmt.com:9060/te_news_industry/2021-09-01/24162.chtml
is no qualitative change. the key of lead-free is in the reflow oven. The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
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