Industry Directory: solder and ball (33)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Max Top Company

Industry Directory |

Solder Wire, Solder Bar, Solder Paste, Solder Ball

New SMT Equipment: solder and ball (239)

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

Electronics Forum: solder and ball (3110)

solder ball

Electronics Forum | Tue Jun 04 22:54:32 EDT 2002 | davef

Solder balls are one of the most popular topics here on SMTnet. Search the fine SMTnet Archives for background. We like to wash solder balls from the board in our cleaner.

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

Used SMT Equipment: solder and ball (31)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

Industry News: solder and ball (1651)

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

Water-Based Flux Line Covers Full Range of Applications

Industry News | 2003-02-17 08:40:25.0

To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements

SMTnet

Parts & Supplies: solder and ball (72)

Panasonic High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue

Panasonic High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue

Parts & Supplies | Screen Printers

High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue ZK Electronic Technology Co.,Limited becky@hysmt.cn www.smt-cn.com skype:beckysmt wechat:15323874439

ZK Electronic Technology Co., Limited

Yamaha Pick and place machine

Yamaha Pick and place machine

Parts & Supplies | Pick and Place/Feeders

Product Description ·   * □ 32mm need to install special nozzle assembly ·   H15mm corresponding height ·   Identify the ball electrode ·   107 corresponds to the maximum number

Qinyi Electronics Co.,Ltd

Technical Library: solder and ball (152)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

Videos: solder and ball (273)

Shuttle Star BGA Rework Station Features Side View Camera

Shuttle Star BGA Rework Station Features Side View Camera

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

PCB solder paste printer, solder paste printer , SMT solder paste printer, stencil PCB printer

PCB solder paste printer, solder paste printer , SMT solder paste printer, stencil PCB printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

Training Courses: solder and ball (26)

Certified IPC Specialist (CIS) Course IPC/WHMA-A-620 with Supplemental Hands-On "Requirements and Acceptance for Cable and Harness Assemblies"

Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)

The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.

Blackfox Training Institute, LLC

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: solder and ball (28)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2

Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2

Surface Mount Technology Association (SMTA)

Career Center - Jobs: solder and ball (19)

Materials Engineer and Lab Supervisor

Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi

Winslow Automation (aka Six Sigma)

Chemical Scale-Up Engineer

Career Center | South Plainfield, New Jersey USA | Engineering

Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh

MacDermid Alpha Electronics Solutions

Career Center - Resumes: solder and ball (11)

SMT and CCA Manufacturing/Process Engineer

Career Center | Grand Rapids, Michigan USA | Engineering,Maintenance,Management,Production,Research and Development,Technical Support

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SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

Express Newsletter: solder and ball (981)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: solder and ball (35851)

Ball Shear Solder Ball Shear | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=1

Ball Shear Solder Ball Shear | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery

ASYMTEK Products | Nordson Electronics Solutions

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Atta

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member

Surface Mount Technology Association (SMTA)


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