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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/bondtesting-systems
F ully Automated Bondtesters Our automated Bondtesters remove the need for operator intervention. They can automatically test the most demanding applications such as high density solder bumps or micro-copper pillars
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=2
. Features and benefits: Low force load cell and jaws enables testing of emerging interconnect technology such as copper ball bonds and stud bumps Pull tests avoids pad cratering artefacts produced by shear tests Copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=1
. Features and benefits: Low force load cell and jaws enables testing of emerging interconnect technology such as copper ball bonds and stud bumps Pull tests avoids pad cratering artefacts produced by shear tests Copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=3
. Features and benefits: Low force load cell and jaws enables testing of emerging interconnect technology such as copper ball bonds and stud bumps Pull tests avoids pad cratering artefacts produced by shear tests Copper
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