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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
C or more above the liquidus. If a solder joint needs to retain physical integrity during a later operation, such as a second reflow process, the peak temperature of the later operation needs to be below the solidus temperature of the alloy
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
C or more above the liquidus. If a solder joint needs to retain physical integrity during a later operation, such as a second reflow process, the peak temperature of the later operation needs to be below the solidus temperature of the alloy
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
process. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive activators
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
parts off during double-sided reflow. Additionally, after eutectic solder is first melted, the alloying that occurs at the sol- der joint during reflow effectively increases the remelting point
