Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Thu Oct 02 01:47:57 EDT 2008 | myleb
I'm new to SMT. Now, i'm making program for SPI machine to inscpect for solder paste of SP60-MU. I think this is a very good printer but some times, my program shows only 50-60% of volume transfer; and the average height is very high: nearly 200 pct.
Electronics Forum | Thu Oct 02 17:00:44 EDT 2008 | davef
Is that accurate? If so, what are your aspect & area ratios? [Similar to the JerryS comment above.] * You say, � � and the average height is very high: nearly 200 pct.� => Our troop can make paste that height too. They snap the stencil-off a fast as
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
Electronics Forum | Fri Apr 27 11:24:53 EDT 2007 | realchunks
Hi Steve-O, Good question(s). This process was set-up by an engineer that had a PhD in statistics, took him a year to develop and then thru it over the wall at us. The biggest problem we saw was SPC to measure solder volume. SPC is good for measu
Electronics Forum | Thu Apr 26 11:40:10 EDT 2007 | CL
Good Morning, We have a 3D solder paste inspection machine. We purchased it on a recommendation from a consultant. We are a CM high mix low volume. The President of my company has attended some seminars and meetings where it was conveyed to her that
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Wed Feb 20 02:12:44 EST 2019 | prasanth
what's the meaning of print pump head in solder paste printing
Electronics Forum | Thu Jan 27 01:21:48 EST 2011 | eliezerk
How can I print two various heights of solder paste on the same board , no space for graded stencil
