Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Solder Paste Mixers
High speed industrial mixer Features 1.Mixing principle is on the basis of Motor rotation and revolution mode of agitation (centrifugal mixing principle), 45° mixing, to get a good mixing result. 2. Jig can be make to order. 3.No need to be opene
Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Electronics Forum | Fri Oct 25 13:23:02 EDT 2019 | SMTA-Joe
Hello SMTA, This may be beyond the scope of the SMTA since it does not strictly deal with assembly of electronics, rather, it is about potential solderless methods for manually tuning RF circuits. Our Engineers & QC have tasked manufacturing with
Industry News | 2023-04-17 08:38:56.0
IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.
Industry News | 2011-01-22 00:27:29.0
Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
SMTnet Express, June 28, 2018, Subscribers: 31,139, Companies: 10,970, Users: 24,880 Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink J. Arrese, G. Vescio, E. Xuriguera, B
Advances in Conductive Inks across Multiple Applications and Deposition Platforms SMTnet Express December 27, 2012, Subscribers: 26070, Members: Companies: 9073, Users: 34093 Advances in Conductive Inks across Multiple Applications and Deposition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/conductive-adhesive?page=3
:2015 Careers Contact Us Service Sales Contacts Support Contacts Global Locations Conductive Adhesive These products are recommended for conductive adhesives applications Products Content Sort Order
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages Optimizing Reflowed Solder TIM (sTIMs
