Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?
Electronics Forum | Wed Jul 22 21:17:55 EDT 2009 | umar
Hi SMTnet Team, I had facing a lot of feedback from my customer interm of the solder splash and solder ball, After I check my process the issues came from manual soldering process. Is any one having the same problem with me ?, any one have solution
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
Electronics Forum | Sun Jul 26 17:13:31 EDT 2009 | slthomas
Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate?
Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Thu May 05 09:17:58 EDT 2005 | jimmiem
I tried soldering to several of the black pads and was successful, the solder stuck with no hesitation. so i guess this is not truly "black pad"? would that be a correct statement? What causes this blackening that looks like oxidation under the mic
Electronics Forum | Fri Jul 20 16:39:18 EDT 2007 | john_smith
Jacky, we have had a similar problem. We needed to go to a smaller nozzle and also check your vacuume system and air kiss.Could be after placement when the machine blows air to insure the part is off the nozzle that it is effecting the solder brick.
Electronics Forum | Thu Jul 21 02:45:51 EDT 2005 | Base
Probably very far-fetched, but I can think of a scenario like this: - machine picks up a component - between vision and placement the part is lost, but the loss is not detected due to oversize tool, which causes the amount of vacuum drop to go unnot
Electronics Forum | Thu Jan 26 02:14:52 EST 2017 | jgo
Hi all, Am new to SMT here. I have a very thin laminate substrate which around 120um thickess. Being that thin, warpage is constantly an issue for us. For the solder printing part, we have a number of problems. Being so thin and warped, we need t
