The premium model that achieves fast, precise, and high-quality soldering operation. Offering two slim types of high performance soldering robots that letting our customers choose the best one to fit their objectives. Both come with a clean cut feed
Industry News | 2011-11-27 00:54:02.0
JBC Tools announces that Productronica 2011 was a great success for JBC Soldering.
Industry News | 2015-01-12 15:51:21.0
Japan Unix Co., a world leader in the development and distribution of soldering robots, announces that it recently translated the Power & High-Temperature Electronics Manufacturing Experience Webinar, conducted by Bob Willis of National Physical Lab, into Japanese and made it available online for free at http://youtu.be/aww0xXp3x1w.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
% total void area specification A major issue and concern with vacuum reflow is solder splatter. If the vacuum pressure is reduced too quickly solder balls can be “splashed
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down