ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
processes. See Nordson EFD solder paste products. Solidus Temperature Temperature below which a solder alloy is completely solid. Spatter or Splatter The dispersion of flux and alloy away from a solder paste deposit due to explosive vaporization of low
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% total void area specification A major issue and concern with vacuum reflow is solder splatter. If the vacuum pressure is reduced too quickly solder balls can be “splashed
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
| http://etasmt.com/te_news_bulletin/2021-08-31/23578.chtml
% total void area specification A major issue and concern with vacuum reflow is solder splatter. If the vacuum pressure is reduced too quickly solder balls can be “splashed
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23578.chtml
% total void area specification A major issue and concern with vacuum reflow is solder splatter. If the vacuum pressure is reduced too quickly solder balls can be “splashed
Heller Industries Inc. | https://hellerindustries.com/vacuum-voidless-reflow-ovens/
. Boards on conveyor experience minimal vibration during travel – including entering and exiting the vacuum chamber. No Solder or Flux Splatter Our vacuum pumps offer closed-loop control for a controlled multi-step pump down and re-fill
Heller Industries Inc. | https://hellerindustries.com/voidless/
. Boards on conveyor experience minimal vibration during travel – including entering and exiting the vacuum chamber. No Solder or Flux Splatter Our vacuum pumps offer closed-loop control for a controlled multi-step pump down and re-fill
Imagineering, Inc. | https://www.pcbnet.com/blog/5-signs-your-pcb-may-need-to-be-repaired-or-replaced/
: Electrical connectivity issues (including open and short circuits). Cold joints lead to weak bonds and intermittent connections. Solder splatter and flux residue
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(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
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