Epibond® 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount
Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipm
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian
Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve
Industry News | 2016-05-09 21:08:21.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2016-07-07 14:54:56.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
446994 - FABRIC MESH BELT , 10"x4.97MT, WITH GUIDE - PEEK Loop with copper, Steel String - (ROLL) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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