Electronics Forum: solder sulfur (14)

Safety equipment for servicing solder wave

Electronics Forum | Thu Aug 21 09:05:07 EDT 2003 | davef

Use a cartridge that's approved [conform to OSHA 42 CFR 84] to provide respiratory protection against organic vapors, chlorine, hydrogen chloride, sulfur dioxide, chlorine dioxide, and hydrogen fluoride with a P100 particulate filter which is effecti

Dewetting in Sn Sufrace PCB in 2 Pass Reflow

Electronics Forum | Thu Feb 09 20:12:51 EST 2017 | imarkl

Any advise about dewetting defect occurrence during 2nd pass reflow. Commonality on affected PCB having water marks near affected pad(s). Elemental composition found on affected pads without solder paste are Silicon and Sulfur. As well as in pad with

Industry News: solder sulfur (3)

SMTA China Presents Best Paper/Presentation Awards & Best Exhibit Awards at SMTA China

Industry News | 2014-09-18 17:55:32.0

SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

SMTA China Presents Nine Best-Paper/Presentation Awards and Two Best Exhibit Awards at SMTA China East 2014 Conference/NEPCON China 2014

Industry News | 2014-05-12 16:06:39.0

SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Technical Library: solder sulfur (2)

Understanding Creep Corrosion Field Fails

Technical Library | 2022-03-16 19:48:18.0

Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction

Foresite Inc.

Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards

Technical Library | 2018-05-09 22:15:29.0

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.

iNEMI (International Electronics Manufacturing Initiative)

Events Calendar: solder sulfur (1)

Corrosion Testing For Electronic Equipment

Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,

Corrosion Testing For Electronic Equipment

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: solder sulfur (977)

SMTnet Express - July 16, 2015

SMTnet Express, July 16, 2015, Subscribers: 23,036, Members: Companies: 14,463, Users: 38,550 Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber iNEMI (International Electronics Manufacturing Initiative) Qualification

SMTnet Express - March 17, 2022

SMTnet Express, March 17, 2022, Subscribers: 25,805, Companies: 11,547, Users: 27,113 Creep Corrosion On Lead-Free Printed Circuit Boards In High Sulfur Environments The material and process changes required to eliminate lead from

Partner Websites: solder sulfur (15)


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