SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
lead-free soldering paste Sn96.5Ag3Cu0.5 lead-free soldering paste Sn96.5Ag3Cu0.5 tin solder paste flux solder paste Product description: lead-free soldering paste Sn96.5Ag3Cu0.5 INQUIRY lead-free soldering paste Sn96.5Ag3Cu0.5 P
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Wed Jun 25 12:13:31 EDT 2003 | russ
A lot of it depends upon what the lead terminations are and the storage conditions. For example if they are tin you will run into trouble. We have used all types of parts that are all ages (We just started doing BGAs that are 5 years old.) I don't
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2010-08-04 21:04:22.0
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.
Technical Library | 1999-05-06 15:31:13.0
Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...
Technical Library | 2003-04-18 12:05:57.0
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Schueller, Ph.D., W. Ables, and J. Fitch, Ph.D. Abstract 22-1 INVESTIGATION OF IMC GROWTH IN TIN SURFACE FINISH AND ITS EFFECT ON SOLDERABILITY IN FC-CSP PACKAGING HyunJung Lee, YeonSeop Yu, HyoJung Kim, Hee-Soo Kim Abstract 22-1 COMPREHENSIVE METHODOLOGY TO
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
with an appropriate solvent. Rosin/Resin (R) Natural or modified pine tree sap. Resins are processed Rosins. Rosin is the mildly acidic sap found in pine trees and was the first fluxing agent used in the Bronze Age. S Shelf Life Duration of time a
