New Equipment | Rework & Repair Services
Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA dev
Application Field SMT/PCBA Package type：BGA、LGA、CSP、POP、SIP... Defect type：Void、HIP、Insufficient、Bridge... Semiconductor Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... Other areas
Electronics Forum | Tue May 21 15:37:36 EDT 2013 | armelinda
I am looking for a service providing non contact PCB flatness measurement for open board SiP assembly. It was returned for failure analysis with complaint that assembly does not solder properly onto customer system board. Since there are remnants o
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Industry News | 2016-09-22 17:27:09.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
| http://etasmt.com/cc?ID=te_news_bulletin,24969&url=_print
. Another key breakthrough in maintaining tight temperature control was the deve lopment of a shorter Center Board Support (CBS) to eliminate thermal interference and prevent board warpage
| https://ipcapexexpo.org/education/call-for-technical-paper-form
Extreme Requirements PCB Fabrication and Materials Quality, Reliability, Test and Inspection Other Assembly Processes Topics BTC/QFN/LGA Assembly Challenges Cleaning Coating Processes Electronics
