Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=114
& Coating Conference ICEHET (formerly ICSR) IWLPC (Wafer-Level) Medical Electronics Symposium Pan Pacific Certification Upcoming Expos All Expos Symposium on Counterfeit Parts and Materials-Tabletop Exhibition Ohio Expo Heartland Expo Houston Expo Juarez Expo
| http://www.thebranfordgroup.com/dnn3/Auction/BENC0423.aspx
% BP for any buyers paying via Credit Card. (Example: a $100 purchase paying by cash instrument the total with BP is $118 and a $100 purchase paying via credit card the total with BP is $121
