New Equipment | Curing Equipment
Anda iCure series of curing ovens are compact, inline Infrared (IR) curing systems. These IR curing ovens are suitable for high volume, rapid curing of heat curable coatings, adhesives, and inks., etc. Models: iCure-2 (2 zones) iCure-3 (3 zones)
Permabond 2-part epoxy adhesives are suitable for bonding a wide variety of materials. Available with a range of different cure speeds to suit, Permabond epoxies have been developed to offer a high standard of performance for demanding bonding applic
New Equipment | Curing Equipment
iCure-2UV is a compact, inline UV curing system. The UV curing oven is suitable for high intensity, rapid curing of UV curable coatings, adhesives, and inks. Standard Features: Edge carrying, variable speed pin chain conveyor Rail expansion comp
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
New Equipment | Curing Equipment
Spectra features Fusion® UV lamps by Heraeus to initiate fast ultraviolet light polymerization of adhesives and coatings in an efficient inline process. Various beam widths are available to accommodate a wide range of substrate dimensions. Spectra
For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati
Lite Fast A-1175 is a black, medical grade adhesive that cures within seconds after application of Ultraviolet light. Lite Fast A-1175 meets USP Class VI testing with extraction at 37�aC for 72 hours. Independent laboratories that are AALAC accredi
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
A continuous motion feeder system used for the separation and transfer of needles into syringe hubs. The syringes are then transferred ready for UV or epoxy adhesive application, curing and inspection. Technical Info: Typical line speed up to 1,000
Lite Fast 3010-M is a low viscosity, one-component conformal coating. It was specifically developed for printed circuit boards (PCBs) as well as hybrid and integrated circuits for military application. Low viscosity enables the resin to flow betwee
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