New SMT Equipment: speed curing (Page 1 of 4)

iCure Infrared (IR) Curing Ovens

iCure Infrared (IR) Curing Ovens

New Equipment | Curing Equipment

Anda iCure series of curing ovens are compact, inline Infrared (IR) curing systems. These IR curing ovens are suitable for high volume, rapid curing of heat curable coatings, adhesives, and inks., etc. Models: iCure-2 (2 zones) iCure-3 (3 zones)

Anda Automation Pte Ltd

Two-Part Epoxies

Two-Part Epoxies

New Equipment | Materials

Permabond 2-part epoxy adhesives are suitable for bonding a wide variety of materials. Available with a range of different cure speeds to suit, Permabond epoxies have been developed to offer a high standard of performance for demanding bonding applic

Permabond Engineering Adhesives

iCure-2UV Ultraviolet (UV) Curing Oven

iCure-2UV Ultraviolet (UV) Curing Oven

New Equipment | Curing Equipment

iCure-2UV is a compact, inline UV curing system. The UV curing oven is suitable for high intensity, rapid curing of UV curable coatings, adhesives, and inks. Standard Features: Edge carrying, variable speed pin chain conveyor Rail expansion comp

Anda Automation Pte Ltd

Electrically Conductive Adhesives

Electrically Conductive Adhesives

New Equipment | Materials

For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring

Zymet, Inc

Spectra Ultraviolet Light Curing System

Spectra Ultraviolet Light Curing System

New Equipment | Curing Equipment

Spectra features Fusion® UV lamps by Heraeus to initiate fast ultraviolet light polymerization of adhesives and coatings in an efficient inline process. Various beam widths are available to accommodate a wide range of substrate dimensions. Spectra

Precision Valve & Automation (PVA)

Non-Conductive Pastes (NCP)

Non-Conductive Pastes (NCP)

New Equipment | Materials

For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati

Zymet, Inc

Lite Fast A-1175

Lite Fast A-1175

New Equipment |  

Lite Fast A-1175 is a black, medical grade adhesive that cures within seconds after application of Ultraviolet light. Lite Fast A-1175 meets USP Class VI testing with extraction at 37�aC for 72 hours. Independent laboratories that are AALAC accredi

MLT/Micro-Lite Technology

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

Needleset Assembly Systems

Needleset Assembly Systems

New Equipment |  

A continuous motion feeder system used for the separation and transfer of needles into syringe hubs. The syringes are then transferred ready for UV or epoxy adhesive application, curing and inspection. Technical Info: Typical line speed up to 1,000

AGR Automation Ltd

Lite Fast 3010-M

Lite Fast 3010-M

New Equipment |  

Lite Fast 3010-M is a low viscosity, one-component conformal coating. It was specifically developed for printed circuit boards (PCBs) as well as hybrid and integrated circuits for military application. Low viscosity enables the resin to flow betwee

MLT/Micro-Lite Technology

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speed curing searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
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Void Free Reflow Soldering

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Win Source Online Electronic parts

We offer SMT Nozzles, feeders and spare parts globally. Find out more