Technical Library: spide and line (Page 1 of 4)

SMT Printing Collapse Causes and Countermeasures --KINGSUN

Technical Library | 2023-12-15 03:06:24.0

The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Unleash Efficiency with Our SMT Flexible Pick and Place Machine

Technical Library | 2023-09-16 07:13:46.0

Experience enhanced flexibility and precision in your assembly line with our state-of-the-art SMT flexible pick and place machine. Optimize production today.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing

Technical Library | 2023-09-18 03:53:42.0

好的,以下是根据标题"LED Lens Production Line Solution"写的SEO元描述和标题: SEO Meta Description (300 characters) LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing Our LED lens production line solutions are the perfect way to improve your LED lens manufacturing efficiency and reliability. Our solutions include all the equipment and services you need to produce high-quality LED lenses, from lens molding to assembly.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

SMT Auto Aqueous Stencil Cleaning Machine: Improve the Quality and Efficiency of Your SMT Stencil Cleaning Process

Technical Library | 2023-09-13 13:03:25.0

SMT auto aqueous stencil cleaning machines are an essential tool for any SMT production line. These machines use a variety of methods to remove contaminants and debris from SMT stencils, which can cause defects and reliability issues.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Technical Library | 2010-12-22 13:59:14.0

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted.

i3 Electronics

Taking the LED Pick and Place Challenge

Technical Library | 2014-09-25 18:16:47.0

For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED revolution. This revolution or change in lighting has some very promising results already in practice and many more companies looking to implement the LED technology into their product portfolio's. With a number of companies looking to expand their portfolio to include LED fixtures there has been an increase in the number of companies that have started their own SMT lines, as well as a significant number of contract manufacturers to meet this new industries demands (...)This presentation will discuss some issues in the pick and place process for LEDs and presents a method to troubleshoot and resolve these issues.

Cree, Inc.

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Technical Library | 2010-05-12 16:21:05.0

Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.

Indium Corporation

1Click SMT Made Successful Installation and Training For Thai Customer!

Technical Library | 2020-04-01 05:52:59.0

Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!

1 CLICK SMT TECHNOLOGY CO., Limited

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

Technical Library | 2021-12-21 23:15:44.0

High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias.

Isola Group

A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing

Technical Library | 2016-06-23 13:24:56.0

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.

Flex (Flextronics International)

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