Industry News: splicing and table (Page 1 of 10)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

Successful Delivery of SMT Production Line in the Greece Security Applications

Industry News | 2023-07-22 07:07:57.0

Experience Success: Seamless SMT Production Line Delivery for Greece Security Applications. Discover how our cutting-edge SMT solutions ensure efficient and reliable manufacturing, tailored to meet the demands of security applications in Greece. Optimize your production process, elevate performance, and achieve excellence with our expertly delivered SMT solutions today!

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

IPC/WHMA-A-620 Training and Certification Centers Up and Running

Industry News | 2003-06-18 07:47:47.0

The training certification program, which assures its participants immediate industry recognition, legitimacy and value, is designed to train operators and potential instructors on proper cable and wire harness fabrication and installation.

Association Connecting Electronics Industries (IPC)

Images and Graphics from IPC/WHMA-A-620B Now Available on DVD

Industry News | 2013-04-29 16:22:20.0

IPC — Association Connecting Electronics Industries® announces the release of a new DVD containing the photos and illustrations found in IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Association Connecting Electronics Industries (IPC)

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

Industry News | 2023-05-15 17:38:25.0

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

eSMART Factory Conference Addresses New Processes and Systems for “Smart” Manufacturing

Industry News | 2019-04-23 07:36:42.0

SMTA announces registration is now open for the 2nd Annual eSMART Factory Conference on June 20-21, 2019 at the Dearborn Inn in Dearborn, MI, USA. Co-organized by Global SMT & Packaging magazine and SMTA, this conference brings together the key technologies shaping the electronics manufacturing industry including software systems and processes, augmented reality and alternative systems.

Surface Mount Technology Association (SMTA)

U.S. Electronics Manufacturers Grappling with Higher Costs from U.S. and Chinese Tariffs; U.S. Jobs and Investments at Risk

Industry News | 2019-10-23 15:26:19.0

Almost 90 percent of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the United States and China on each other’s imports, and some are investing less in the United States and hiring fewer workers as a result.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Industry News | 2009-04-15 23:12:38.0

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC Releases IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards

Industry News | 2015-08-20 13:42:15.0

IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.

Association Connecting Electronics Industries (IPC)

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