HANDI-VAC KIT, Static dissipative, with conductive silicone vacuum cups. (1) 1/8" and (1) 1/4" vacuum cups on bent probes and (1) 1/8" and (1) 3/8" vacuum cups on straight probes. Our HANDI-VAC kits are a low cost pick-and-place tool that can go in
The anti-wobble tool is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placment accuracy when picking processor chips from a shipping tray and placing into precision sockets. This BULB-VAC features an ant
Electronics Forum | Thu Mar 04 12:49:49 EST 1999 | SMTASSY
| Are square pads more difficult to wavesolder than round pads? | I am referring to a through hole board. | Usualy square pads are for indication of pin 1 on a DIP for example. There might be a difference in the capilary affect due to a different su
JUKI SMT machine RX-7R element mount speed (best condition) : chip element 75,000CPH ELEMENT SIZE: 03015 chip □25mm square element P16 suction nozzle mount head, realized high-speed, high-density Mount p 8 suction nozzle mount head to the small
A JUKI high-speed patch machine JX-350 prototype and JUKI long substrate high-speed patch machine JX-350 are available for sale. They are most suitable for LED lighting machines or LED patch machines for medium and large LCD backlight production.&nbs
Industry News | 2012-11-16 11:43:59.0
MIRTEC,, announces the completion of an expansion project to its manufacturing facility in Anseong, South Korea.
Industry News | 2008-09-25 16:15:43.0
COLORADO SPRINGS, CO � September 24, 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the compressed air powered STEALTH-VAC.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Events Calendar | Thu Apr 07 00:00:00 EDT 2022 - Thu Apr 07 00:00:00 EDT 2022 | Palm Bay, Florida USA
Space Coast Chapter Technical Meeting: Printed Wiring Board Fabrication Design Attributes
Events Calendar | Tue Mar 07 00:00:00 EST 2017 - Thu Mar 09 00:00:00 EST 2017 | Shanghai, China
CPCA 2017, China International PCB & Assembly Show
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part
PCB Libraries Forum : BGA with Square Pins PCB Libraries Forum : BGA with Square Pins This is an XML content feed of; PCB Libraries Forum : Questions & Answers
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