Career Center | Rancho Cucamonga, California USA | Production
The successful candidate will have at least one year experience and knowledge in Pick and Place programming for machines such as Fuji, Samsung, Panasonic, or Tyco; stencil printing and solder past knowledge; wave solder and wave solder washing proce
Career Center | , | Production
Western Massachusetts based electronic contract manufacturer of PCB Assemblies seeks experienced (2-4 years minimum) SMT Machine Operator. Job requirements are: Operate, maintain and program Automated and Semi-Automated equipment used in Printed Ci
Career Center | Gaithersburg, Maryland USA | Engineering,Maintenance,Production
Position is responsible for all aspects of the production process including: * Programming pick & place equipment (Siemens) * Programming Stencil Printing Equipment (MPM) * Profiling reflow oven (Speedline) * Profliling wave solder (Vitronics-Soltec
Career Center | Porterville, California USA | Production
Please refer to Req. No.: 01-2154-0000-53 in all correspondence. * * * * * * Market Guidelines for Pay: $ 3474 � 5210/month. Excellent benefits package available. Supervise and provide process engineering support for the surface mount manufacturing
Career Center | Fort Lauderdale, Florida USA | Production
About Us URtech Manufacturing is a North American provider of end-to-end Electronic Manufacturing Services (EMS) to OEMs since 2010. Our services extend from product concept to commercialization, supporting the entire product life cycle. We build
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Lincoln, Nebraska USA | Engineering
Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r
Career Center | Lincoln, Nebraska USA | Engineering
Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi
Career Center | Lititz, Pennsylvania USA | Engineering
Provides advanced engineering expertise in support of the design, and integration of highly complex circuit card assemblies. Technical expertise should include a broad background in circuit card assembly with a strong concentration in surface mount
Career Center | Lumberton, USA | Engineering,Production
Metal Etching Technology Inc. is one of the United States leading Manufacturers of solder paste stencils for the electronics industry. Candidate's responsibilities will include printing and manipulating cad data, transferring files via internet/em
