Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2013-06-26 09:09:19.0
The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.
Industry News | 2020-04-14 22:14:18.0
ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.
Industry News | 2014-01-07 18:55:28.0
Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.
Industry News | 2010-08-04 21:04:22.0
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2015-07-06 10:34:12.0
The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.
Industry News | 2017-10-17 20:26:17.0
ITW EAE, the Electronic Assembly Equipment division of ITW will be attending Productronica, November 14-17, 2017 in Munich, Germany. The ITW EAE booth (Hall A4, Booth 554) will be displaying and demonstrating the latest advances in the MPM, Camalot, Electrovert, Vitronics Soltec and Despatch product lines.
