New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
GXHB��3000 Digital Brinell Hardness Tester Usage Range The Brinell hardness test that shows the largest indentation among all the hardness tests is able to reflect the comprehensive features of the material, and the test is unaffected by the organ
Electronics Forum | Thu Mar 19 07:57:13 EDT 2020 | leeg
Which model of Dek265 is it?
Electronics Forum | Fri Mar 20 03:30:55 EDT 2020 | leeg
Have you tried to Zero the x and Y offset and removed the stencil and re-inserted?
Used SMT Equipment | Pick and Place/Feeders
2018 Mycronic My300 SX-11 Pick and Place Make: Mycronic Model: MY300SX-11 Vintage: 2018 Description: SMT Pick & Place Details: 2 heads (midas & hydra) 11 bay pick and place Electrical 2 Pole Test Electrical Transister Test Shared Data bases Hydra El
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Parts & Supplies | Circuit Board Assembly Products
Juki Key-press control card of KE750 40000905 STOPER GRAME FR ASM →40020551 40000906 STOPER FRAME FR →40020552 40000908 IN SENSOR ASM *19 40000909 STOPPER 40000910 STOPPER PIN 40000911 STOPPER CONNECTER 40000912 SENSOR ADJUST SPRIG 40000914
Parts & Supplies | Chipshooters / Chip Mounters
191492 BOM^ASSY.^MOTOR^RISING TABLE 1 188962 BOM^MOTOR^DRIVE^PRINT CARRIAGE 160457 cluch 183388 in or out pcb sensor 7 188317 BOM^LOOM^CAMERA CARRIAGE SIGNALS 1 185253 NEXTMOVE ES USB 6 STEP CONTROLLER(TXT) 1 165675 CYLINDER 4 STROKE 20 BORE (
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Pick & Place for large PCB. Max PCB 36" x 60". Dual Nozzle, Laser Align, On the fly. Custom build, Windows 7 OS
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Thu Jun 14 00:00:00 EDT 2018 | China, China
The birth of steel pipe is for the goal of better life
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/pumps-and-pump-systems?con=t&page=9
Pumps, pumping stations & pressure containers for wide range of liquid adhesive pressures | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
Lewis & Clark | http://www.lewis-clark.com/product-tag/t4-table/
T4 Table Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
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