New Equipment | Wave Soldering
Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D
New Equipment | Industrial Automation
Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Moore Automation Limited Our services Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)War
Electronics Forum | Tue Jun 24 20:31:52 EDT 2003 | tejasdpatel
Hi People! We are leading assembler of car audio systems in US. Since last few weeks we have extream problems with wavesolder operations, bridging is a major defect. To solve this we have decided to install Hot Air Knife. I contacted Electrovert but
Electronics Forum | Fri Nov 05 12:38:07 EST 1999 | Rich Cary
We are looking for some sealed (pressurized?) flux tanks with low qty. warning for use with our Tamura spray flux machines. I have heard that a company named "Binks" has made similar tanks for other companies, but when I search on the net for them I
Used SMT Equipment | Soldering - Reflow
Looking for a good condition refurbished TAMURA reflow oven Qty : 1 unit 8 Zones Right to Left flow, with N2 function Contact if have stock Look forward business with you Rgds Nathan Jack H.F.T. Pte Ltd Singapore
Industry News | 2010-04-22 19:34:44.0
TORRANCE, CA - Seika Machinery, Inc., a leading distributor of advanced machinery, materials and engineering services, now provides special academic discounts to university labs and other organizations that provide educational services to engineering students.
Technical Library | 2016-01-07 19:13:23.0
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and electroless copper plating. PTFE is widely used in many industries because of its unique electrical, thermal, and mechanical characteristics. However, because of its low surface energy, it is difficult to acquire enough adhesion strength between PTFE and other substances without surface modification. Plasma is well known as one of the surface modification techniques that improve adhesion strength.
Technical Library | 2017-10-05 17:13:04.0
Intermetallic compounds (IMC) in solder bonds are commonly considered critical for the reliability of interconnections. The microstructure and thermal aging characteristics of solder bonds of crystalline silicon solar cells are investigated, whereby two solders, Sn60Pb40 and a lead-free, low melting point alternative Sn41Bi57Ag2 are considered.
| https://kyzen.com/download/certifications/KYZEN_CFSI_CMRT_V5.12_20190514.xlsx
| https://qualitek.com/wp-content/uploads/2020/05/CFSI_CMRT_6.0-1.xlsx
to that product or any of a product’s sub-components if that 3TG was not necessary to the product’s generally expected function, use, or purpose. Similarly, the guidance presumes that a 3TG would not be necessary to the production of a product unless
