China second hand Automatic Solder paste printer good quality Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China second hand Automatic Solder paste printer
New Equipment | Soldering - Other
SMT Stencil Printer China second hand Automatic Solder paste printer good quality Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China second han
Electronics Forum | Thu Jul 16 09:22:18 EDT 1998 | Aaron Delfausse
My question is in regards to how exactly temperature and humidity affect the stencil printing process. If temperatures here at the plant in the summer are 70-73 degrees F. and relative humidity is 60-65%,to what extent will the results of the steci
Electronics Forum | Fri Jul 17 11:49:58 EDT 1998 | Justin Medernach
| My question is in regards to how exactly temperature and humidity affect the stencil printing process. If temperatures here at the plant in the summer are 70-73 degrees F. and relative humidity is 60-65%,to what extent will the results of the ste
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
XTECH Auctions announces ETM Auction ☀ October 17–21, 2021 SMTnet Express, October 21, 2021, Subscribers: 26,585, Companies: 11,455, Users: 26,807 PCB Surface Finishes & The Cleaning Process - A Compatibility Study All PCBs
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Sethuraman, Richard Coyle, Richard Popowich and Peter Read, “The Effect of Process Voiding on BGA Solder Joint Fatigue Life Measured in Accelerated Temperature Cycling,” Proceedings of SMTAI 2007, 368- 373, Orlando, FL, October 2007. [15] Richard Coyle
| https://www.smtfactory.com/What-is-the-function-of-the-temperature-and-humidity-sensor-in-Lyra-Reflow-Oven-id44562477.html
paste solder pre-allocated on the printed board pads. . This kind of Lyra Reflow Oven has a heating circuit inside, which heats air or nitrogen to a high enough temperature and blows it to the circuit board where the component is already attached, so that
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