Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
New Equipment | Surface Finish
VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels. The ModVIA is designed to process rigid and flexible PCB panels of various shapes and sizes for through-hole, blind via, etchback,
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Used SMT Equipment | Soldering Equipment/Fluxes
In-line Selective Solder S/N : 0611830601 Description: * Two Pots: SAC305 PB-Free * Includes Gas Nitrogen circuit * 3x400 V 33 kVA 50/60Hz * 410mm x 410mm Standard Gripper * Preheater with 12 IR Elements * Gantry robot fluxer (with flux m
Used SMT Equipment | Repair/Rework
ONYX 29 KEY FEATURES SUMMARY: AXIS MOVEMENTS: All 7 axis motorised, closed loop motion control MANUALMOTION: via integrated hand wheels PC: With Windows based software. UP TO 8 THERMOCOUPLE PORTS: to control process temperatures. AUTOMATIC SIT
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Parts & Supplies | Pick and Place/Feeders
Any interesting, feel free to contact via mail: yzfs1968@aliyun.com, Mobile: +86-13501595476 532221604096 4022 594 21990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 DIO CARD 4022 594 22510 BITBUS CARD 5322 216 04099 CAN PCB PCI 166/CAL 5322
Parts & Supplies | Pick and Place/Feeders
Any interesting, feel free to contact via mail: yzfs1968@aliyun.com, Mobile: +86-13501595476 4022 594 21990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 DIO CARD 4022 594 22510 BITBUS CARD 5322 216 04099 CAN PCB PCI 166/CAL 5322 252 11118 FUSE, 5
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Nano-copper sintering in formic acid vapor.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , | Engineering,Research and Development,Technical Support
INTRODUCTION Ref: TR/EMP/EXP/VOL.IV/05 Mobil Consulting/Recruiting Services; Pursuant to the service contract with the NIGERIAN MOBIL OIL COMPANY (NMOC) FIELD DEVELOPMENT PROJECT in Nigeria, has been mandated to recruit senior services expatriat
Career Center | WARRI, DELTA Nigeria | Engineering,Maintenance,Production,Research and Development
INTRODUCTION Ref: TR/EMP/EXP/VOL.IV/05 Mobil Consulting/Recruiting Services; Pursuant to the service contract with the NIGERIAN MOBIL OIL COMPANY (NMOC) FIELD DEVELOPMENT PROJECT in Nigeria, has been mandated to recruit senior services expatriat
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
VIA High Volume Series | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
2.5.6 Cap Plating 22 A-600 Additions 2.5.6 Cap Plating 23 2.9.7 Tenting of Via Holes Clarification of terms. 24 Added Section 2.10.1.3 Conductor Thickness 25
