Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer
Electronic Test Engineering Services
Industry Directory | Consultant / Service Provider / Manufacturer
Full Range Of ICT Test Solutions And Services , Full DFT Analysis, Contract Engineering. Turnkey Teradyne Teststation (GenRad 228x), Turnkey Teradyne 18XX, Turnkey Agilent 3070 Series and Full Flying Probe Solutions
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh
Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an
Electronics Forum | Sun Sep 12 08:30:29 EDT 2004 | davef
Well, another alternative is to use a water washable flux. If you insist on staying with a NC flux, use one that is probable. We prefer to probe solder, rather than copper.
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | In-Circuit Testers
JDSU FST-2802-V6 Acterna Ethernet and Fibre Channel services module with FST2000 TestPad The FST2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troub
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Parts & Supplies | SMT Equipment
SMT SPARE PARTS SMT Machine Parts SIEMENS Ceram Pads TAPE 00359505 Specifications: Brand Name SIEMENS Ceram Pads TAPE Part number 00359505 Model Ensure Tested Guarantee 1 month usage for machine SIEMENS ASM Sell & Buy Smt machine and spa
Parts & Supplies | SMT Equipment
SMT SPARE PARTS SMT Machine Parts SIEMENS COM PRESSION SPRING 00309103 Specifications: Brand Name SIEMENS Ceram Pads TAPE Part number 00309103 Model Ensure Tested Guarantee 1 month usage for machine SIEMENS ASM Sell & Buy Smt machine and
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Lincoln, Nebraska USA | Engineering
Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r
Career Center | Lincoln, Nebraska USA | Engineering
Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
SMTnet Express, October 20, 2016, Subscribers: 26,525, Companies: 15,001, Users: 41,289 Analysis of Laminate Material Properties for Correlation to Pad Cratering Carlos Morillo, Yan Ning, Michael H. Azarian, Julie Silk, Michael Pecht.; CALCE Pad
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/flexural-test
Flexural test X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pad-to-pad-vs-pad-to-thermal-tab_topic3075_post12275.html
Pad to Pad vs Pad to Thermal Tab - PCB Libraries Forum Forum Home > General > General Discussion New Posts FAQ Search Events Register Login Pad to Pad vs Pad to Thermal Tab
