New SMT Equipment: tg and fine and pitch (32)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Trim and Form Services

Trim and Form Services

New Equipment | Components

SemiPack's capabilities range from fully automatic to manual processing; extensive cropping and forming capabilities; active and passive component processing; axial to radial lead forming servicing; and snap-in and stand-off forms. For SMT processi

SemiPack Services INC

Electronics Forum: tg and fine and pitch (96)

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk

We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:48:33 EDT 2002 | davef

Fabs can produce a solder mask web between 20 pitch leads, but I've never seen a web for 16 pitch leads. Although, I would like know a supplier that can lay-down a fine web. Minimum solder mask web width is about 0.004 thou. An absolute mininum o

Used SMT Equipment: tg and fine and pitch (5)

Samsung Auto Pick and Place

Samsung Auto Pick and Place

Used SMT Equipment | General Purpose Equipment

Samsung Auto Pick and Place Machine 7500 pph,Lead Screw Refurbished w/ 15 8mm Feeders 2 Heads, InLine A fast (7,500 cph) machine with a long history of reliability that’s ideal for assemblers on a small budget who require high throughput. Fast and

UAT

Mydata Mycronic MY100-LXe-10 InLine Pick and Place

Mydata Mycronic MY100-LXe-10 InLine Pick and Place

Used SMT Equipment | Pick and Place/Feeders

Sku 16530 • Latest Tpsys 5.1.1 software in July of 2020• Upgraded from PF3 to PF4 CPU• Upgraded  VVG2 ED-3D board • Rated Speed 15 000 CPH • Chip Net Throughput 13 500 CPH• Fine Pitch Accuracy @ Cpk = 1.33 (X, Y, Theta) 35 μm, 0.09º• Fine Pitch Repea

SMT Devices

Industry News: tg and fine and pitch (99)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Parts & Supplies: tg and fine and pitch (1)

Yamaha Which series nozzles could be used for Phlips Topaz and Emerald machine

Yamaha Which series nozzles could be used for Phlips Topaz and Emerald machine

Parts & Supplies | Pick and Place/Feeders

Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and

ZK Electronic Technology Co., Limited

Technical Library: tg and fine and pitch (11)

Step Stencil design when 01005 and 0.3mm pitch uBGA's coexist with RF Shields

Technical Library | 2023-07-25 16:50:02.0

Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.

Photo Stencil LLC

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Videos: tg and fine and pitch (7)

2016 Mycronic My200 DX-14 Pick and Place Machine

2016 Mycronic My200 DX-14 Pick and Place Machine

Videos

Make: Mycronic Model: My200DX-14 Vintage: 2016 SW Version: TPSys 3.3.2 Details: • Electrical Two-Pole Test • Optical Centering • Barcode Reader • Conveyor • Shared Databases • HYDRA • Z High Speed • HYDRA High Speed • Autoteach • Linescan for Z

Lewis & Clark

Pcb and fpc hotbar soldering machine

Pcb and fpc hotbar soldering machine

Videos

Hotbar soldering

YUSH Electronic Technology Co.,Ltd

Training Courses: tg and fine and pitch (3)

Workmanship Standards and Instruction for the Soldering & Rework of Through-Hole and Surface Mount Components

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: tg and fine and pitch (1)

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Surface Mount Technology Association (SMTA)

Express Newsletter: tg and fine and pitch (197)

SMTnet Express - December 31, 2015

SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International

Partner Websites: tg and fine and pitch (308)

Mydata/Mycronic Feeders TM8FC -8mm Fine pitch Magazine - Part# L14021C - Lewis and Clark

Lewis & Clark | http://www.lewis-clark.com/product/mydata-feeders-tm8fc-8mm-fine-pitch-magazine/

Mydata/Mycronic Feeders TM8FC -8mm Fine pitch Magazine - Part# L14021C - Lewis and Clark Skip to content My Cart:  0 View Cart Checkout No products in the cart. Subtotal

Lewis & Clark

FUJI FUJI XPF-L Fine Pitch Placer XPF-L | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/xpf-l-fuji-xpf-l-fine-pitch-placer-217430?page=155

FUJI FUJI XPF-L Fine Pitch Placer XPF-L | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products FUJI XPF-L Fine Pitch Placer Public Pricelist Public

Qinyi Electronics Co.,Ltd


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