Electronics Forum | Wed Feb 15 21:49:40 EST 2006 | Jose Luis Mendoza
Hi there,, Im looking for information about history and evolution of the PIH process. I will use this information for the state-of-the -art in my Master.D tesis project. Any information will be appreciate! Regards. Jos� Luis Mendoza ITESM
Electronics Forum | Wed Feb 15 21:54:07 EST 2006 | Jose Luis Mendoza
Hi there,, Im looking for information about history and evolution of the PIH process. I will use this information for the state-of-the -art in my Master.D tesis project. Any information will be appreciate! Regards. Jos� Luis Mendoza ITESM jlmen
Industry News | 2019-10-30 18:25:26.0
Robert Cooke, NASA aerospace engineer and electronics industry subject matter expert, will deliver a technical education workshop, “The Evolution of IPC’s Cable & Wire Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620 at the WHMA 27th Annual Wire Harness Conference, February 18, 2020, in Las Vegas, Nevada.
Industry News | 2020-01-07 11:35:11.0
PDR is pleased to announce plans to exhibit its rework equipment at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company will display the award-winning E6S Evolution Rework System in Booth #1213.
Technical Library | 2018-08-16 12:18:23.0
Appliance designers are constantly evolving to satisfy the ever changing wants and needs of their consumer base. These changes filter down and include not only the materials but also the equipment used to dispense the material in the manufacturing processes. Moreover, the latest evolution of appliances also seeks to add luxury controls and eye-catching applications. This challenge then, of new applications and material dispensing, often means the application and execution of these increasingly complex materials present multiple challenges up and down the appliance supply chain. Successfully meeting the material dispensing challenge has the potential to spur growth significantly in the higher-end appliance industry as the manufacturing adhesion processes evolve to meet market demand.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Three-Dimensional MMIC and Its Evolution to WLCSP Technology Three-Dimensional MMIC and Its Evolution to WLCSP Technology by: Tsuneo TOKUMITSU; Sumitomo Electric Industries, Ltd. The history of multilayered, three-dimensional monolithic microwave
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/reflowevolution.pdf
Reflow Evolution Reduces Costs, Improves Reliability Reflow Evolution Reduces Costs, Improves Reliability New solder reflow technology is resulting in lower nitrogen consumption and significant cost
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
project’s timeline or escalate production costs. All electronic components must integrate into a single board function harmoniously. PCB designers must navigate the rapid evolution of IoT devices, which often feature compartmentalized designs with sub-circuits
A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.
Manufacturer / Equipment Dealer / Broker / Auctions
896 Main Street
Branford, CT USA
Phone: 203-488-7020
